JPH0135484Y2 - - Google Patents
Info
- Publication number
- JPH0135484Y2 JPH0135484Y2 JP921984U JP921984U JPH0135484Y2 JP H0135484 Y2 JPH0135484 Y2 JP H0135484Y2 JP 921984 U JP921984 U JP 921984U JP 921984 U JP921984 U JP 921984U JP H0135484 Y2 JPH0135484 Y2 JP H0135484Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- cold plate
- contact
- integrated circuit
- mat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46429483A | 1983-02-07 | 1983-02-07 | |
| US464294 | 1983-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6057139U JPS6057139U (ja) | 1985-04-20 |
| JPH0135484Y2 true JPH0135484Y2 (en]) | 1989-10-30 |
Family
ID=23843332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP921984U Granted JPS6057139U (ja) | 1983-02-07 | 1984-01-27 | 集積回路チツプ冷却装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS6057139U (en]) |
| CA (1) | CA1203640A (en]) |
| DE (1) | DE3404027A1 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4312057A1 (de) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung |
| JP4626082B2 (ja) * | 2001-04-16 | 2011-02-02 | 株式会社日立製作所 | 冷却水路を備えた電気装置 |
| EP1506576A1 (de) | 2002-05-22 | 2005-02-16 | Siemens Aktiengesellschaft | Kühlvorrichtungen zum kühlen elektrischer bauteile, modul aus kühlvorrichtung und elektrischen bauteilen, und anordnung aus kühlvorrichtung oder modul und trägerkörper |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
-
1983
- 1983-05-18 CA CA000428435A patent/CA1203640A/en not_active Expired
-
1984
- 1984-01-27 JP JP921984U patent/JPS6057139U/ja active Granted
- 1984-02-06 DE DE19843404027 patent/DE3404027A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6057139U (ja) | 1985-04-20 |
| CA1203640A (en) | 1986-04-22 |
| DE3404027A1 (de) | 1984-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4551787A (en) | Apparatus for use in cooling integrated circuit chips | |
| US4509096A (en) | Chip-carrier substrates | |
| US4758926A (en) | Fluid-cooled integrated circuit package | |
| US4631636A (en) | High density packaging technique for electronic systems | |
| US5397747A (en) | Vertical chip mount memory package and method | |
| US5812374A (en) | Electrical circuit cooling device | |
| US6055154A (en) | In-board chip cooling system | |
| US4860444A (en) | Method of assembling a fluid-cooled integrated circuit package | |
| US20030139071A1 (en) | Thermally enhanced interposer and method | |
| JP2882706B2 (ja) | 電子回路とその熱制御 | |
| JPH0325023B2 (en]) | ||
| JPH0661606A (ja) | 回路パッケージ構造 | |
| JPS6224658A (ja) | 集積回路パツケ−ジ | |
| JPH04229645A (ja) | 電子回路パッケージ・モジュール | |
| JPH07240496A (ja) | 半導体装置、その製造方法、半導体素子のテスト方法、そのテスト基板およびそのテスト基板の製造方法 | |
| JPS62238653A (ja) | 冷却構造 | |
| JPH07202463A (ja) | 電子回路モジュール | |
| JPH077282A (ja) | 回路部品をパックする装置 | |
| US5546274A (en) | Three-dimensional compact array of electronic circuitry | |
| JPH10189845A (ja) | 半導体素子の放熱装置 | |
| JP2001168131A (ja) | 薄型相互接続構造 | |
| JPH0135484Y2 (en]) | ||
| EP0527583B1 (en) | Method and apparatus for interconnecting devices using TAB in board technology | |
| JP2006135202A (ja) | 電子機器の放熱構造 | |
| JPH07297359A (ja) | マルチチップモジュールとマルチチップモジュール用コネクタ |